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1 Ergebnisse
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Investigation of bump defects formed in back end of line fo..:
Zhou, Ming
;
Hao, Deng
;
Beichao, Zhang
Surface and Interface Analysis. 48 (2016) 10 - p. 1072-1079 , 2016
Link:
https://doi.org/10.1002/sia.6029
RT Journal T1 <Title>Investigation of bump defects formed in back end of line for 28 nm technological node</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_sia.6029&Exemplar=1&LAN=DE A1 Zhou, Ming A1 Hao, Deng A1 Beichao, Zhang PB Wiley YR 2016 SN 0142-2421 SN 1096-9918 JF Surface and Interface Analysis VO 48 IS 10 SP 1072 OP 1079 LK http://dx.doi.org/https://doi.org/10.1002/sia.6029 DO https://doi.org/10.1002/sia.6029 SF ELIB - SuUB Bremen
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