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1 Ergebnisse
1
Inverse Modeling: Glue-Package-Die Problem:
, In:
Mathematics in Industry; Nanoelectronic Coupled Problems Solutions
,
Pulch, Roland
;
Putek, Piotr
;
De Gersem, Herbert
. - p. 279-289 , 2019
Link:
https://doi.org/10.1007/978-3-030-30726-4_12
RT T1 <cTitle>Mathematics in Industry; Nanoelectronic Coupled Problems Solutions</cTitle>: T1 <Title>Inverse Modeling: Glue-Package-Die Problem</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_978-3-030-30726-4_12&Exemplar=1&LAN=DE A1 Pulch, Roland A1 Putek, Piotr A1 De Gersem, Herbert A1 Gillon, Renaud PB Springer International Publishing YR 2019 SP 279 OP 289 LK http://dx.doi.org/https://doi.org/10.1007/978-3-030-30726-4_12 DO https://doi.org/10.1007/978-3-030-30726-4_12 SF ELIB - SuUB Bremen
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