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1 Ergebnisse
1
Effect of Moisture Content on Crack Formation During Reflow..:
, In:
Advances in Robotics, Automation and Data Analytics; Advances in Intelligent Systems and Computing
,
Zain, Syed Mohamad Mardzukey Syed Mohamed
;
Ani, Fakhrozi Che
;
Ramli, Mohamad Riduwan
.. - p. 309-314 , 2021
Link:
https://doi.org/10.1007/978-3-030-70917-4_29
RT T1 <cTitle>Advances in Robotics, Automation and Data Analytics; Advances in Intelligent Systems and Computing</cTitle>: T1 <Title>Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_978-3-030-70917-4_29&Exemplar=1&LAN=DE A1 Zain, Syed Mohamad Mardzukey Syed Mohamed A1 Ani, Fakhrozi Che A1 Ramli, Mohamad Riduwan A1 Jalar, Azman A1 Bakar, Maria Abu PB Springer International Publishing YR 2021 SP 309 OP 314 LK http://dx.doi.org/https://doi.org/10.1007/978-3-030-70917-4_29 DO https://doi.org/10.1007/978-3-030-70917-4_29 SF ELIB - SuUB Bremen
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