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Interconnects Reliability for Future Cryogenic Memory Appli..:

, In: Springer Series in Reliability Engineering; Interconnect Reliability in Advanced Memory Device Packaging,
Gan, Chong Leong, ; Huang, Chen-Yu, - p. 185-207 , 2023
Link: https://doi.org/10.1007/978-3-031-26708-6_8