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Fundamentals of Heat Dissipation in 3D IC Packaging and The..:
, In:
3D Microelectronic Packaging; Springer Series in Advanced Microelectronics
,
Kandlikar, Satish G.
;
Ganguly, Amlan
- p. 369-395 , 2020
Link:
https://doi.org/10.1007/978-981-15-7090-2_13
RT T1 <cTitle>3D Microelectronic Packaging; Springer Series in Advanced Microelectronics</cTitle>: T1 <Title>Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_978-981-15-7090-2_13&Exemplar=1&LAN=DE A1 Kandlikar, Satish G. A1 Ganguly, Amlan PB Springer Singapore YR 2020 SP 369 OP 395 LK http://dx.doi.org/https://doi.org/10.1007/978-981-15-7090-2_13 DO https://doi.org/10.1007/978-981-15-7090-2_13 SF ELIB - SuUB Bremen
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