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Repairing TSVs for 3D ICs Using Redundant TSV:

, In: Proceedings of International Conference on Industrial Instrumentation and Control; Lecture Notes in Electrical Engineering,
Ghosh, Sudeep ; Banik, Mandira ; Chakraborty, Tridib... - p. 129-141 , 2022
Link: https://doi.org/10.1007/978-981-16-7011-4_13