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Research on Mechanical Properties and Anti-vibration Perfor..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Phan, Quoc Phu ; Huynh, Thi Ngoc Diem ; Cao, Xuan Viet.. - p. 593-602 , 2023
Link: https://doi.org/10.1007/978-981-19-9267-4_59