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A Short Review: Reliability Issues of Lead-Free Sn-Based Al..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Tan, Y. P. ; Somidin, F. - p. 63-71 , 2023
Link: https://doi.org/10.1007/978-981-19-9267-4_8