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1
Thermo-electro-mechanical Effects of Copper TSV Interconnec..:
, In:
Proceedings of 4th International Conference on Frontiers in Computing and Systems; Lecture Notes in Networks and Systems
,
Chaudhuri, Debika
;
Jamal, Rashid
;
Rahaman, Hafizur
. - p. 627-636 , 2024
Link:
https://doi.org/10.1007/978-981-97-2611-0_42
RT T1 <cTitle>Proceedings of 4th International Conference on Frontiers in Computing and Systems; Lecture Notes in Networks and Systems</cTitle>: T1 <Title>Thermo-electro-mechanical Effects of Copper TSV Interconnects on the MOS Characteristics in Stacked 3D Integration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_978-981-97-2611-0_42&Exemplar=1&LAN=DE A1 Chaudhuri, Debika A1 Jamal, Rashid A1 Rahaman, Hafizur A1 Ghosh, Tamal PB Springer Nature Singapore YR 2024 SP 627 OP 636 LK http://dx.doi.org/https://doi.org/10.1007/978-981-97-2611-0_42 DO https://doi.org/10.1007/978-981-97-2611-0_42 SF ELIB - SuUB Bremen
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