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Microstructural Evolution During Homogenization of Ni–Cu–Al..:

, In: Springer Proceedings in Physics; Proceedings of the 3rd International Conference on Advances in Materials Processing: Challenges and Opportunities,
Udare, Anand ; Chenna Krishna, S. ; Muneshwar, Pravin. - p. 61-68 , 2023
Link: https://doi.org/10.1007/978-981-99-1971-0_10