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Study on the Adhesion of UV Ink in Tinplate Printing:
, In:
Lecture Notes in Electrical Engineering; Innovative Technologies for Printing, Packaging and Digital Media
,
Wu, Zhenxing
;
Wei, Zhen
- p. 342-351 , 2024
Link:
https://doi.org/10.1007/978-981-99-9955-2_44
RT T1 <cTitle>Lecture Notes in Electrical Engineering; Innovative Technologies for Printing, Packaging and Digital Media</cTitle>: T1 <Title>Study on the Adhesion of UV Ink in Tinplate Printing</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_978-981-99-9955-2_44&Exemplar=1&LAN=DE A1 Wu, Zhenxing A1 Wei, Zhen PB Springer Nature Singapore YR 2024 SP 342 OP 351 LK http://dx.doi.org/https://doi.org/10.1007/978-981-99-9955-2_44 DO https://doi.org/10.1007/978-981-99-9955-2_44 SF ELIB - SuUB Bremen
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