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1 Ergebnisse
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Footprint study of ultrasonic wedge-bonding with aluminum w..:
Lum, I.
;
Mayer, M.
;
Zhou, Y.
Journal of Electronic Materials. 35 (2006) 3 - p. 433-442 , 2006
Link:
https://doi.org/10.1007/bf02690530
RT Journal T1 <Title>Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_bf02690530&Exemplar=1&LAN=DE A1 Lum, I. A1 Mayer, M. A1 Zhou, Y. PB Springer Science and Business Media LLC YR 2006 SN 0361-5235 SN 1543-186X JF Journal of Electronic Materials VO 35 IS 3 SP 433 OP 442 LK http://dx.doi.org/https://doi.org/10.1007/bf02690530 DO https://doi.org/10.1007/bf02690530 SF ELIB - SuUB Bremen
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