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Job releasing and throughput planning for wafer fabrication..:
Chung, Shu-Hsing
;
Lai, Chun-Mei
The International Journal of Advanced Manufacturing Technology. 31 (2006) 3-4 - p. 316-327 , 2006
Link:
https://doi.org/10.1007/s00170-005-0185-8
RT Journal T1 <Title>Job releasing and throughput planning for wafer fabrication under demand fluctuating make-to-stock environment</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s00170-005-0185-8&Exemplar=1&LAN=DE A1 Chung, Shu-Hsing A1 Lai, Chun-Mei PB Springer Science and Business Media LLC YR 2006 SN 0268-3768 SN 1433-3015 JF The International Journal of Advanced Manufacturing Technology VO 31 IS 3-4 SP 316 OP 327 LK http://dx.doi.org/https://doi.org/10.1007/s00170-005-0185-8 DO https://doi.org/10.1007/s00170-005-0185-8 SF ELIB - SuUB Bremen
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