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Packaging using hot-embossing with a polymeric intermediate..:
Khan Malek, Chantal
;
Duffait, Roland
The International Journal of Advanced Manufacturing Technology. 33 (2006) 1-2 - p. 187-190 , 2006
Link:
https://doi.org/10.1007/s00170-006-0595-2
RT Journal T1 <Title>Packaging using hot-embossing with a polymeric intermediate mould</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s00170-006-0595-2&Exemplar=1&LAN=DE A1 Khan Malek, Chantal A1 Duffait, Roland PB Springer Science and Business Media LLC YR 2006 SN 0268-3768 SN 1433-3015 JF The International Journal of Advanced Manufacturing Technology VO 33 IS 1-2 SP 187 OP 190 LK http://dx.doi.org/https://doi.org/10.1007/s00170-006-0595-2 DO https://doi.org/10.1007/s00170-006-0595-2 SF ELIB - SuUB Bremen
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