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Correction to: Establishing a theoretical model for abrasiv..:
Lin, Zone-Ching
;
Wang, Ren-Yuan
;
Jhang, Zih-Wun
The International Journal of Advanced Manufacturing Technology. 95 (2018) 9-12 - p. 4685-4686 , 2018
Link:
https://doi.org/10.1007/s00170-017-1532-2
RT Journal T1 <Title>Correction to: Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s00170-017-1532-2&Exemplar=1&LAN=DE A1 Lin, Zone-Ching A1 Wang, Ren-Yuan A1 Jhang, Zih-Wun PB Springer Science and Business Media LLC YR 2018 SN 0268-3768 SN 1433-3015 JF The International Journal of Advanced Manufacturing Technology VO 95 IS 9-12 SP 4685 OP 4686 LK http://dx.doi.org/https://doi.org/10.1007/s00170-017-1532-2 DO https://doi.org/10.1007/s00170-017-1532-2 SF ELIB - SuUB Bremen
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