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1 Ergebnisse
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Preparing CuBr particles onto the commercial copper foil su..:
Ding, Keqiang
;
Yan, Mengying
;
Di, Mengyao
...
Journal of Solid State Electrochemistry. 28 (2023) 2 - p. 619-633 , 2023
Link:
https://doi.org/10.1007/s10008-023-05715-3
RT Journal T1 <Title>Preparing CuBr particles onto the commercial copper foil surface to greatly boost the electrochemical performance of tin dioxide</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10008-023-05715-3&Exemplar=1&LAN=DE A1 Ding, Keqiang A1 Yan, Mengying A1 Di, Mengyao A1 Li, Mengjiao A1 Li, Weijia A1 Wang, Hui PB Springer Science and Business Media LLC YR 2023 SN 1432-8488 SN 1433-0768 JF Journal of Solid State Electrochemistry VO 28 IS 2 SP 619 OP 633 LK http://dx.doi.org/https://doi.org/10.1007/s10008-023-05715-3 DO https://doi.org/10.1007/s10008-023-05715-3 SF ELIB - SuUB Bremen
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