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Heat transfer improvement study of electronic component sur..:
Karabulut, Koray
Journal of Computational Electronics. 18 (2019) 4 - p. 1259-1271 , 2019
Link:
https://doi.org/10.1007/s10825-019-01387-3
RT Journal T1 <Title>Heat transfer improvement study of electronic component surfaces using air jet impingement</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10825-019-01387-3&Exemplar=1&LAN=DE A1 Karabulut, Koray PB Springer Science and Business Media LLC YR 2019 SN 1569-8025 SN 1572-8137 JF Journal of Computational Electronics VO 18 IS 4 SP 1259 OP 1271 LK http://dx.doi.org/https://doi.org/10.1007/s10825-019-01387-3 DO https://doi.org/10.1007/s10825-019-01387-3 SF ELIB - SuUB Bremen
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