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1 Ergebnisse
1
Properties of SnAgCu/SnAgCuCe soldered joints for electroni..:
Zhang, Liang
;
Xue, Song-bai
;
Gao, Li-li
...
Journal of Materials Science: Materials in Electronics. 21 (2009) 6 - p. 635-642 , 2009
Link:
https://doi.org/10.1007/s10854-009-9969-1
RT Journal T1 <Title>Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-009-9969-1&Exemplar=1&LAN=DE A1 Zhang, Liang A1 Xue, Song-bai A1 Gao, Li-li A1 Sheng, Zhong A1 Zeng, Guang A1 Chen, Yan A1 Yu, Sheng-lin PB Springer Science and Business Media LLC YR 2009 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 21 IS 6 SP 635 OP 642 LK http://dx.doi.org/https://doi.org/10.1007/s10854-009-9969-1 DO https://doi.org/10.1007/s10854-009-9969-1 SF ELIB - SuUB Bremen
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