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Reliability of printed circuit boards containing lead-free ..:
Moshrefi-Torbati, M.
;
Swingler, J.
Journal of Materials Science: Materials in Electronics. 22 (2010) 4 - p. 400-411 , 2010
Link:
https://doi.org/10.1007/s10854-010-0150-7
RT Journal T1 <Title>Reliability of printed circuit boards containing lead-free solder in aggressive environments</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-010-0150-7&Exemplar=1&LAN=DE A1 Moshrefi-Torbati, M. A1 Swingler, J. PB Springer Science and Business Media LLC YR 2010 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 22 IS 4 SP 400 OP 411 LK http://dx.doi.org/https://doi.org/10.1007/s10854-010-0150-7 DO https://doi.org/10.1007/s10854-010-0150-7 SF ELIB - SuUB Bremen
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