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1 Ergebnisse
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Formation and behavior of Kirkendall voids within intermeta..:
Kim, Doosoo
;
Chang, Jong-hyeon
;
Park, Jungil
.
Journal of Materials Science: Materials in Electronics. 22 (2011) 7 - p. 703-716 , 2011
Link:
https://doi.org/10.1007/s10854-011-0357-2
RT Journal T1 <Title>Formation and behavior of Kirkendall voids within intermetallic layers of solder joints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-011-0357-2&Exemplar=1&LAN=DE A1 Kim, Doosoo A1 Chang, Jong-hyeon A1 Park, Jungil A1 Pak, James Jungho PB Springer Science and Business Media LLC YR 2011 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 22 IS 7 SP 703 OP 716 LK http://dx.doi.org/https://doi.org/10.1007/s10854-011-0357-2 DO https://doi.org/10.1007/s10854-011-0357-2 SF ELIB - SuUB Bremen
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