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1 Ergebnisse
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Lapping assisted dissolved wafer process of silicon for MEM..:
Dutta, Shankar
;
Kumar, Manoj
;
Kumar, Surender
...
Journal of Materials Science: Materials in Electronics. 25 (2014) 4 - p. 1984-1990 , 2014
Link:
https://doi.org/10.1007/s10854-014-1833-2
RT Journal T1 <Title>Lapping assisted dissolved wafer process of silicon for MEMS structures</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-014-1833-2&Exemplar=1&LAN=DE A1 Dutta, Shankar A1 Kumar, Manoj A1 Kumar, Surender A1 Imran, Md A1 Yadav, Isha A1 Kumar, Anand A1 Kumar, P. A1 Pal, Ramjay PB Springer Science and Business Media LLC YR 2014 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 25 IS 4 SP 1984 OP 1990 LK http://dx.doi.org/https://doi.org/10.1007/s10854-014-1833-2 DO https://doi.org/10.1007/s10854-014-1833-2 SF ELIB - SuUB Bremen
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