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1 Ergebnisse
1
Effect of TiO2 nanoparticle addition and cooling rate on mi..:
Huang, C. H.
;
Chen, Chin-Hsin
;
Chang, S. Y.
..
Journal of Materials Science: Materials in Electronics. 26 (2015) 6 - p. 3493-3501 , 2015
Link:
https://doi.org/10.1007/s10854-015-2860-3
RT Journal T1 <Title>Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-015-2860-3&Exemplar=1&LAN=DE A1 Huang, C. H. A1 Chen, Chin-Hsin A1 Chang, S. Y. A1 Tsao, L. C. A1 Chen, R. S. PB Springer Science and Business Media LLC YR 2015 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 26 IS 6 SP 3493 OP 3501 LK http://dx.doi.org/https://doi.org/10.1007/s10854-015-2860-3 DO https://doi.org/10.1007/s10854-015-2860-3 SF ELIB - SuUB Bremen
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