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Reliability study of lead-free solders under specific condi..:
Liu, Shuang
;
Xue, Song-bai
Journal of Materials Science: Materials in Electronics. 26 (2015) 12 - p. 9424-9442 , 2015
Link:
https://doi.org/10.1007/s10854-015-3283-x
RT Journal T1 <Title>Reliability study of lead-free solders under specific conditions</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-015-3283-x&Exemplar=1&LAN=DE A1 Liu, Shuang A1 Xue, Song-bai PB Springer Science and Business Media LLC YR 2015 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 26 IS 12 SP 9424 OP 9442 LK http://dx.doi.org/https://doi.org/10.1007/s10854-015-3283-x DO https://doi.org/10.1007/s10854-015-3283-x SF ELIB - SuUB Bremen
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