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1 Ergebnisse
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Enhanced lead-free solder wettability of oxidized-nickel by..:
Lin, Yung-Sen
;
Lai, Jin-Chu
;
Tsai, Tzung-Han
Journal of Materials Science: Materials in Electronics. 26 (2015) 9 - p. 6853-6859 , 2015
Link:
https://doi.org/10.1007/s10854-015-3301-z
RT Journal T1 <Title>Enhanced lead-free solder wettability of oxidized-nickel by Ar–H2 plasmas for flip chip bumping</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-015-3301-z&Exemplar=1&LAN=DE A1 Lin, Yung-Sen A1 Lai, Jin-Chu A1 Tsai, Tzung-Han PB Springer Science and Business Media LLC YR 2015 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 26 IS 9 SP 6853 OP 6859 LK http://dx.doi.org/https://doi.org/10.1007/s10854-015-3301-z DO https://doi.org/10.1007/s10854-015-3301-z SF ELIB - SuUB Bremen
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