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1 Ergebnisse
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Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu..:
Shnawah, Dhafer Abdulameer
;
Sabri, Mohd Faizul Mohd
;
Said, Suhana Binti Mohd
...
Journal of Materials Science: Materials in Electronics. 26 (2015) 10 - p. 8229-8239 , 2015
Link:
https://doi.org/10.1007/s10854-015-3486-1
RT Journal T1
Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method
UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-015-3486-1&Exemplar=1&LAN=DE A1 Shnawah, Dhafer Abdulameer A1 Sabri, Mohd Faizul Mohd A1 Said, Suhana Binti Mohd A1 Jauhari, Iswadi A1 Mahdavifard, Mohammad Hossein A1 Bashir, Mohamed Bashir Ali A1 Elsheikh, Mohamed Hamid PB Springer Science and Business Media LLC YR 2015 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 26 IS 10 SP 8229 OP 8239 LK http://dx.doi.org/https://doi.org/10.1007/s10854-015-3486-1 DO https://doi.org/10.1007/s10854-015-3486-1 SF ELIB - SuUB Bremen
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