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Composition design of Sn-rich Sn–Au–Ag solders using cluste..:
Huang, M. L.
;
Huang, F. F.
;
Yang, Y. C.
Journal of Materials Science: Materials in Electronics. 28 (2017) 15 - p. 11192-11201 , 2017
Link:
https://doi.org/10.1007/s10854-017-6907-5
RT Journal T1 <Title>Composition design of Sn-rich Sn–Au–Ag solders using cluster-plus-glue-atom model</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-017-6907-5&Exemplar=1&LAN=DE A1 Huang, M. L. A1 Huang, F. F. A1 Yang, Y. C. PB Springer Science and Business Media LLC YR 2017 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 28 IS 15 SP 11192 OP 11201 LK http://dx.doi.org/https://doi.org/10.1007/s10854-017-6907-5 DO https://doi.org/10.1007/s10854-017-6907-5 SF ELIB - SuUB Bremen
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