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1 Ergebnisse
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Microstructure, wetting characteristics and hardness of tin..:
Fouzder, Tama
;
Gain, Asit Kumar
;
Chan, Daniel K.
Journal of Materials Science: Materials in Electronics. 28 (2017) 22 - p. 16921-16931 , 2017
Link:
https://doi.org/10.1007/s10854-017-7611-1
RT Journal T1 <Title>Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-017-7611-1&Exemplar=1&LAN=DE A1 Fouzder, Tama A1 Gain, Asit Kumar A1 Chan, Daniel K. PB Springer Science and Business Media LLC YR 2017 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 28 IS 22 SP 16921 OP 16931 LK http://dx.doi.org/https://doi.org/10.1007/s10854-017-7611-1 DO https://doi.org/10.1007/s10854-017-7611-1 SF ELIB - SuUB Bremen
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