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Electromigration behaviors in Sn–58Bi solder joints under d..:

Wang, Fengjiang ; Liu, Luting ; Li, Dongyang.
Journal of Materials Science: Materials in Electronics.  29 (2018)  24 - p. 21157-21169 , 2018
Link: https://doi.org/10.1007/s10854-018-0264-x