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1 Ergebnisse
1
Effect of thermal cycles on interface and mechanical proper..:
Sun, Lei
;
Chen, Ming-he
;
Wei, Chun-chun
..
Journal of Materials Science: Materials in Electronics. 29 (2018) 12 - p. 9757-9763 , 2018
Link:
https://doi.org/10.1007/s10854-018-9014-3
RT Journal T1 <Title>Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-018-9014-3&Exemplar=1&LAN=DE A1 Sun, Lei A1 Chen, Ming-he A1 Wei, Chun-chun A1 Zhang, Liang A1 Yang, Fan PB Springer Science and Business Media LLC YR 2018 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 29 IS 12 SP 9757 OP 9763 LK http://dx.doi.org/https://doi.org/10.1007/s10854-018-9014-3 DO https://doi.org/10.1007/s10854-018-9014-3 SF ELIB - SuUB Bremen
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