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Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu ..:

Leong, Y. M. ; Haseeb, A. S. M. A. ; Nishikawa, Hiroshi.
Journal of Materials Science: Materials in Electronics.  30 (2019)  13 - p. 11914-11922 , 2019
Link: https://doi.org/10.1007/s10854-019-01532-5