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1 Ergebnisse
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Thermal and mechanical property of FCLED package component ..:
Lee, Choong-Jae
;
Jeong, Haksan
;
Jung, Kwang-Ho
..
Journal of Materials Science: Materials in Electronics. 30 (2019) 14 - p. 12869-12875 , 2019
Link:
https://doi.org/10.1007/s10854-019-01648-8
RT Journal T1 <Title>Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-019-01648-8&Exemplar=1&LAN=DE A1 Lee, Choong-Jae A1 Jeong, Haksan A1 Jung, Kwang-Ho A1 Min, Kyung Deuk A1 Jung, Seung-Boo PB Springer Science and Business Media LLC YR 2019 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 30 IS 14 SP 12869 OP 12875 LK http://dx.doi.org/https://doi.org/10.1007/s10854-019-01648-8 DO https://doi.org/10.1007/s10854-019-01648-8 SF ELIB - SuUB Bremen
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