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1 Ergebnisse
1
Wettability, interfacial reaction and mechanical properties..:
Sun, Lei
;
Chen, Ming-he
;
Zhang, Liang
..
Journal of Materials Science: Materials in Electronics. 30 (2019) 20 - p. 18462-18470 , 2019
Link:
https://doi.org/10.1007/s10854-019-02200-4
RT Journal T1 <Title>Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-019-02200-4&Exemplar=1&LAN=DE A1 Sun, Lei A1 Chen, Ming-he A1 Zhang, Liang A1 Xie, Lan-sheng A1 Wei, Chun-chun PB Springer Science and Business Media LLC YR 2019 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 30 IS 20 SP 18462 OP 18470 LK http://dx.doi.org/https://doi.org/10.1007/s10854-019-02200-4 DO https://doi.org/10.1007/s10854-019-02200-4 SF ELIB - SuUB Bremen
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