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Influence of additives on electroplated copper films and sh..:

Zhang, Xudong ; Hu, Xiaowu ; Jiang, Xiongxin..
Journal of Materials Science: Materials in Electronics.  31 (2019)  3 - p. 2320-2330 , 2019
Link: https://doi.org/10.1007/s10854-019-02764-1