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Fast formation of Ni–Sn intermetallic joints using Ni–Sn pa..:

Jeong, So-Eun ; Jung, Seung-Boo ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics.  31 (2020)  18 - p. 15048-15060 , 2020
Link: https://doi.org/10.1007/s10854-020-04068-1