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Effect of Ag solutes on the solid-state Cu dissolution in t..:

Wang, Jyun-Yang ; Lin, Yi-Xuan ; Yeh, Ching-Yu...
Journal of Materials Science: Materials in Electronics.  32 (2020)  1 - p. 567-576 , 2020
Link: https://doi.org/10.1007/s10854-020-04839-w