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Impact of in situ current stressing on Sn-based solder join..:
Fuller, Scott
;
Sheikh, Mohamed
;
Baty, Greg
..
Journal of Materials Science: Materials in Electronics. 32 (2021) 3 - p. 2853-2864 , 2021
Link:
https://doi.org/10.1007/s10854-020-05038-3
RT Journal T1 <Title>Impact of in situ current stressing on Sn-based solder joint shear stability</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-020-05038-3&Exemplar=1&LAN=DE A1 Fuller, Scott A1 Sheikh, Mohamed A1 Baty, Greg A1 Kim, Choong-Un A1 Lee, Tae-Kyu PB Springer Science and Business Media LLC YR 2021 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 32 IS 3 SP 2853 OP 2864 LK http://dx.doi.org/https://doi.org/10.1007/s10854-020-05038-3 DO https://doi.org/10.1007/s10854-020-05038-3 SF ELIB - SuUB Bremen
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