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1 Ergebnisse
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Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/EN..:
Tian, Ruyu
;
Tian, Yanhong
;
Huang, Yilong
...
Journal of Materials Science: Materials in Electronics. 32 (2021) 6 - p. 6890-6899 , 2021
Link:
https://doi.org/10.1007/s10854-021-05395-7
RT Journal T1 <Title>Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-021-05395-7&Exemplar=1&LAN=DE A1 Tian, Ruyu A1 Tian, Yanhong A1 Huang, Yilong A1 Yang, Dongsheng A1 Chen, Cheng A1 Sun, Huhao PB Springer Science and Business Media LLC YR 2021 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 32 IS 6 SP 6890 OP 6899 LK http://dx.doi.org/https://doi.org/10.1007/s10854-021-05395-7 DO https://doi.org/10.1007/s10854-021-05395-7 SF ELIB - SuUB Bremen
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