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1 Ergebnisse
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In-situ thin film copper–copper thermocompression bonding f..:
Rouhi, Sina
;
Ozdemir, Mehtap
;
Ekmekcioglu, Merve
...
Journal of Materials Science: Materials in Electronics. 32 (2021) 11 - p. 15605-15614 , 2021
Link:
https://doi.org/10.1007/s10854-021-06109-9
RT Journal T1 <Title>In-situ thin film copper–copper thermocompression bonding for quantum cascade lasers</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-021-06109-9&Exemplar=1&LAN=DE A1 Rouhi, Sina A1 Ozdemir, Mehtap A1 Ekmekcioglu, Merve A1 Yigen, Serap A1 Demirhan, Yasemin A1 Szerling, Anna A1 Kosiel, Kamil A1 Kozubal, Maciej A1 Kruszka, Renata A1 Prokaryn, Piotr A1 Ertugrul, Mehmet A1 Reno, John L. A1 Aygun, Gulnur A1 Ozyuzer, Lutfi PB Springer Science and Business Media LLC YR 2021 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 32 IS 11 SP 15605 OP 15614 LK http://dx.doi.org/https://doi.org/10.1007/s10854-021-06109-9 DO https://doi.org/10.1007/s10854-021-06109-9 SF ELIB - SuUB Bremen
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