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Development of Sn-1.0Ag-0.7Cu composite solder with improve..:
El-Daly, A. A.
;
Ibrahiem, A. A.
;
Eid, N. A. M.
Journal of Materials Science: Materials in Electronics. 32 (2021) 14 - p. 19871-19889 , 2021
Link:
https://doi.org/10.1007/s10854-021-06512-2
RT Journal T1 <Title>Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-021-06512-2&Exemplar=1&LAN=DE A1 El-Daly, A. A. A1 Ibrahiem, A. A. A1 Eid, N. A. M. PB Springer Science and Business Media LLC YR 2021 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 32 IS 14 SP 19871 OP 19889 LK http://dx.doi.org/https://doi.org/10.1007/s10854-021-06512-2 DO https://doi.org/10.1007/s10854-021-06512-2 SF ELIB - SuUB Bremen
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