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1 Ergebnisse
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Main application limitations of lead-free composite solder ..:
Chen, Guang
;
Wu, Yaofeng
Journal of Materials Science: Materials in Electronics. 32 (2021) 20 - p. 24644-24660 , 2021
Link:
https://doi.org/10.1007/s10854-021-06938-8
RT Journal T1 <Title>Main application limitations of lead-free composite solder doped with foreign reinforcements</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-021-06938-8&Exemplar=1&LAN=DE A1 Chen, Guang A1 Wu, Yaofeng PB Springer Science and Business Media LLC YR 2021 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 32 IS 20 SP 24644 OP 24660 LK http://dx.doi.org/https://doi.org/10.1007/s10854-021-06938-8 DO https://doi.org/10.1007/s10854-021-06938-8 SF ELIB - SuUB Bremen
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