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1 Ergebnisse
1
Investigation of RuZn alloy as barrier to Cu interconnect:
Wang, Peng
;
Qu, Xin-Ping
;
Dordi, Yezdi
.
Journal of Materials Science: Materials in Electronics. 33 (2022) 9 - p. 6318-6328 , 2022
Link:
https://doi.org/10.1007/s10854-022-07806-9
RT Journal T1 <Title>Investigation of RuZn alloy as barrier to Cu interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-022-07806-9&Exemplar=1&LAN=DE A1 Wang, Peng A1 Qu, Xin-Ping A1 Dordi, Yezdi A1 Joi, Aniruddha PB Springer Science and Business Media LLC YR 2022 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 33 IS 9 SP 6318 OP 6328 LK http://dx.doi.org/https://doi.org/10.1007/s10854-022-07806-9 DO https://doi.org/10.1007/s10854-022-07806-9 SF ELIB - SuUB Bremen
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