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Effects of immersion silver (ImAg) and immersion tin (ImSn)..:
Amli, S. F. Muhd
;
Salleh, M. A. A. Mohd
;
Ramli, M. I. I.
...
Journal of Materials Science: Materials in Electronics. 33 (2022) 17 - p. 14249-14263 , 2022
Link:
https://doi.org/10.1007/s10854-022-08353-z
RT Journal T1 <Title>Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-022-08353-z&Exemplar=1&LAN=DE A1 Amli, S. F. Muhd A1 Salleh, M. A. A. Mohd A1 Ramli, M. I. I. A1 Aziz, M. S. Abdul A1 Yasuda, H. A1 Chaiprapa, J. A1 Nogita, K. PB Springer Science and Business Media LLC YR 2022 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 33 IS 17 SP 14249 OP 14263 LK http://dx.doi.org/https://doi.org/10.1007/s10854-022-08353-z DO https://doi.org/10.1007/s10854-022-08353-z SF ELIB - SuUB Bremen
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