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1 Ergebnisse
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Severe embrittlement of copper pillar bumps electrodeposite..:
Ding, Zi-feng
;
Wang, Xiao-jing
;
Wang, Wen-dong
...
Journal of Materials Science: Materials in Electronics. 33 (2022) 24 - p. 19026-19035 , 2022
Link:
https://doi.org/10.1007/s10854-022-08741-5
RT Journal T1 <Title>Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-022-08741-5&Exemplar=1&LAN=DE A1 Ding, Zi-feng A1 Wang, Xiao-jing A1 Wang, Wen-dong A1 Cai, Shan-shan A1 Guo, Jing-dong A1 Zhu, Qing-sheng PB Springer Science and Business Media LLC YR 2022 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 33 IS 24 SP 19026 OP 19035 LK http://dx.doi.org/https://doi.org/10.1007/s10854-022-08741-5 DO https://doi.org/10.1007/s10854-022-08741-5 SF ELIB - SuUB Bremen
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