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1 Ergebnisse
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Joint reliability of Al wire bonding on OSP and ENIG surfac..:
Ahn, Byeongjin
;
Kim, Jahyeon
;
Cheon, Gyeong-Yeong
...
Journal of Materials Science: Materials in Electronics. 33 (2022) 26 - p. 21127-21136 , 2022
Link:
https://doi.org/10.1007/s10854-022-08917-z
RT Journal T1 <Title>Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-022-08917-z&Exemplar=1&LAN=DE A1 Ahn, Byeongjin A1 Kim, Jahyeon A1 Cheon, Gyeong-Yeong A1 Lee, Tae-Ik A1 Park, Young-Bae A1 Kim, Jungsoo A1 Ko, Yong-Ho PB Springer Science and Business Media LLC YR 2022 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 33 IS 26 SP 21127 OP 21136 LK http://dx.doi.org/https://doi.org/10.1007/s10854-022-08917-z DO https://doi.org/10.1007/s10854-022-08917-z SF ELIB - SuUB Bremen
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