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1 Ergebnisse
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Microwave sintering Ag nanoparticle interconnects infiltrat..:
Liu, Boyu
;
Yu, Yongli
;
Jiang, Dandan
...
Journal of Materials Science: Materials in Electronics. 34 (2023) 2 - p. , 2023
Link:
https://doi.org/10.1007/s10854-022-09548-0
RT Journal T1
Microwave sintering Ag nanoparticle interconnects infiltrated by silver acetate ammonia mixed solution
UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-022-09548-0&Exemplar=1&LAN=DE A1 Liu, Boyu A1 Yu, Yongli A1 Jiang, Dandan A1 Hu, Zhengnan A1 Ma, Liuhong A1 Li, Mengke A1 Zhong, Yinghui A1 Duan, Zhiyong PB Springer Science and Business Media LLC YR 2023 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 34 IS 2 LK http://dx.doi.org/https://doi.org/10.1007/s10854-022-09548-0 DO https://doi.org/10.1007/s10854-022-09548-0 SF ELIB - SuUB Bremen
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