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An investigation of the bonding properties of Cu particle-f..:
Youn, Hee Jun
;
Lee, Jeong Il
;
Ha, Min Jeong
..
Journal of Materials Science: Materials in Electronics. 34 (2023) 10 - p. , 2023
Link:
https://doi.org/10.1007/s10854-023-10276-2
RT Journal T1 <Title>An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-023-10276-2&Exemplar=1&LAN=DE A1 Youn, Hee Jun A1 Lee, Jeong Il A1 Ha, Min Jeong A1 Kim, Jong-Min A1 Yim, Byung-Seung PB Springer Science and Business Media LLC YR 2023 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 34 IS 10 LK http://dx.doi.org/https://doi.org/10.1007/s10854-023-10276-2 DO https://doi.org/10.1007/s10854-023-10276-2 SF ELIB - SuUB Bremen
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