I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
On the optimization of molding warpage for wafer-level glas..:
Bao, Shuchao
;
Li, Wei
;
He, Yimin
...
Journal of Materials Science: Materials in Electronics. 34 (2023) 12 - p. , 2023
Link:
https://doi.org/10.1007/s10854-023-10475-x
RT Journal T1 <Title>On the optimization of molding warpage for wafer-level glass interposer packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-023-10475-x&Exemplar=1&LAN=DE A1 Bao, Shuchao A1 Li, Wei A1 He, Yimin A1 Zhong, Yi A1 Zhang, Long A1 Yu, Daquan PB Springer Science and Business Media LLC YR 2023 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 34 IS 12 LK http://dx.doi.org/https://doi.org/10.1007/s10854-023-10475-x DO https://doi.org/10.1007/s10854-023-10475-x SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
