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1 Ergebnisse
1
In or Ni addition on mechanical properties and interfacial ..:
Chen, Jiawei
;
Liao, Mingqing
;
Wang, Fengjiang
Journal of Materials Science: Materials in Electronics. 34 (2023) 20 - p. , 2023
Link:
https://doi.org/10.1007/s10854-023-10971-0
RT Journal T1 <Title>In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-023-10971-0&Exemplar=1&LAN=DE A1 Chen, Jiawei A1 Liao, Mingqing A1 Wang, Fengjiang PB Springer Science and Business Media LLC YR 2023 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 34 IS 20 LK http://dx.doi.org/https://doi.org/10.1007/s10854-023-10971-0 DO https://doi.org/10.1007/s10854-023-10971-0 SF ELIB - SuUB Bremen
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