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1 Ergebnisse
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Microstructures and mechanical properties of ultrasonic-wel..:
Kim, Hyeon-Tae
;
Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 34 (2023) 29 - p. , 2023
Link:
https://doi.org/10.1007/s10854-023-11432-4
RT Journal T1 <Title>Microstructures and mechanical properties of ultrasonic-welded Cu–Cu joints for power module terminals in electric vehicles</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-023-11432-4&Exemplar=1&LAN=DE A1 Kim, Hyeon-Tae A1 Yoon, Jeong-Won PB Springer Science and Business Media LLC YR 2023 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 34 IS 29 LK http://dx.doi.org/https://doi.org/10.1007/s10854-023-11432-4 DO https://doi.org/10.1007/s10854-023-11432-4 SF ELIB - SuUB Bremen
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