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1 Ergebnisse
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Improving mechanical stability of Al/Cu ultrasonic bonded j..:
Jeong, Jong-Min
;
Kim, Dongjin
;
Kim, Jungsoo
...
Journal of Materials Science: Materials in Electronics. 35 (2024) 4 - p. , 2024
Link:
https://doi.org/10.1007/s10854-023-11913-6
RT Journal T1 <Title>Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1007_s10854-023-11913-6&Exemplar=1&LAN=DE A1 Jeong, Jong-Min A1 Kim, Dongjin A1 Kim, Jungsoo A1 Bang, Junghwan A1 Jung, Seung-Boo A1 Kim, Min-Su PB Springer Science and Business Media LLC YR 2024 SN 0957-4522 SN 1573-482X JF Journal of Materials Science: Materials in Electronics VO 35 IS 4 LK http://dx.doi.org/https://doi.org/10.1007/s10854-023-11913-6 DO https://doi.org/10.1007/s10854-023-11913-6 SF ELIB - SuUB Bremen
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